PCB Soldering Temperature

PCB ‘s components are one of the commonly used components in modern electronic devices, and their soldering temperature is also a very important parameter. The correct soldering temperature can ensure the soldering quality and long-term stability of the components, while incorrect soldering temperature will lead to problems such as component failure.

Next, we will introduce the PCB soldering temperature of Kinglisheng (Shenzhen) Electronic and Technology Co., Ltd.

-PCB Soldering

The principle of PCB soldering is to connect the component pins to the pads on the printed circuit board to form a circuit. The two commonly used soldering methods are hot air soldering and wave soldering. Hot air soldering is to pre-coat the component pins and pads with solder paste, and then use hot air to heat and fuse them. Wave soldering is to place the printed circuit board in a solder tank and use the wave crest to impact the solder onto the pad to solder the components

First, let me introduce our commonly used welding process.

01 PCB Selective soldering

In selective soldering, only certain areas are in contact with the solder wave. Since the PCB itself is a poor heat-conducting medium, it will not heat and melt the solder joints of adjacent components and PCB areas during soldering.

Flux must also be applied in advance before soldering. The flux is only applied to the lower part of the PCB to be soldered, but selective soldering is not suitable for soldering SMD components.

02 PCB’s Dip soldering process

Using the dip soldering process, 0.7mm~10mm solder joints can be soldered. The soldering process of short pins and small-sized pads is more stable and the possibility of bridging is also small. The distance between the edges of adjacent solder joints, devices and soldering nozzles should be greater than 5mm.

Select the dip soldering process and use the following parameter settings:

①Solder temperature 275℃~300℃

②Immersion speed 20mm/s~25mm/s

③Immersion time 1s~3s

④Post-immersion speed 2mm/s

⑤Shock pump rate is determined by the number of soldering nozzles

03 Through-hole reflow

Through-hole reflow (THR) is the process of assembling through-hole components and special-shaped components using reflow soldering technology.

The purpose of the reflow soldering process is to gradually melt the solder and slowly heat the connection interface to avoid damage to electronic components caused by rapid heating. In the traditional reflow soldering process, it is usually divided into four stages, called "zones", and each zone has its own temperature curve: "preheating", "heat soaking", "reflow" and "cooling".

04 Use shielded mold wave soldering process

Because traditional wave soldering technology cannot cope with the soldering of fine-pitch and high-density SMD components on the soldering surface, a new method has emerged: using a shielded mold to shield the SMD components to achieve wave soldering of the plug-in leads on the soldering surface.

05 Automatic soldering machine technology

Because traditional wave soldering technology cannot cope with the welding of double-sided SMDs, high-density SMD components and components that are not resistant to high temperatures, a new method has emerged: using an automatic soldering machine to achieve welding of soldering surface plug-ins.

-PCB Soldering Temperature

01. Importance of welding temperature