How We Manufacturing PCB
PCB Board Manufacturing is Printed Circuit Board Manufacturing.Kinglisheng is one of the PCB board manufacturers in China with 10 years experience in PCB board manufacturing. We can make PCB boards with layers from 1 - 32 layers.
At Kinglisheng, we have our own technology and stringent production processes, with which we meet and exceed our customers' expectations.Kinglisheng has brought in talented people and cutting-edge technology, and our dedication to delivering quality PCB products and services has helped us earn the trust and respect of our customers.
We are constantly striving to improve our solutions and have not spared any money in investing in new equipment and talented people. This keeps us at the forefront of the industry, and we can offer a first-class service from PCB manufacturing to assembly, testing and delivery. Even if you only have an idea, we can help you realize success. We've done beauty devices, sensors, rechargeable batteries, student management systems and more.
I will introduce our PCB manufacturing process below.
PCB board manufacturing steps
First: PCB film generation
All films for copper and soldermask are made from photo-exposed polyester film. We generate these films from your design files, creating an accurate (1:1) film representation of your design. When submitting Gerber files, each individual Gerber file represents one layer of the PCB.
Second: PCB Selection Raw Material
Industry standard 1.6mm thick FR-4 laminated copper cladding on both sides. The panels will be sized to fit multiple circuit boards.
Third: PCB Drilling
The through holes required to create the PCB design come from your submission using an NC drill and carbide drill bit.
Fourth: PCB without copper plating
In order to through-hole to electrically connect to the different layers of the PCB, a thin layer of copper is chemically deposited in the through-hole. This copper will subsequently be thickened by electrolytic copper plating.
Fifth: PCB Application Photoresist and Imaging
To transfer the PCB design from electronic CAD data to the physical circuit board, we first apply photosensitive photoresist to the panel, covering the entire board area. The copper laminate image (step 1) is then placed on the board and a high intensity UV light source exposes the uncovered portion of the photoresist. We then chemically develop the board (removing the unexposed photoresist from the panel) to form pads and alignments.
Sixth: PCB Pattern Board
This step is an electrochemical process that builds copper thickness into the holes and onto the surface of the PCB. Once the copper thickness has been built up in the circuitry and holes, we apply an additional layer of tin to the exposed surface. This tin will protect the copper plating during the etching process (step 7) and be removed later.
Seven: PCB Striping & PCB Etching