2022-12-19
What are the reasons for poor soldering of BGA? Several common problems in PCB design.
Today, I will tell you what are the reasons for the poor soldering of BGA? Several common problems in PCB design. In PCBA processing, due to improper PCB design, the problem of poor BGA soldering is often encountered.Next, we will summarize and analyze several common problems in bad BGA soldering PCB design.
Analysis of BGA soldering defects caused by incorrect PCB design
1. The hole at the bottom of the BGA has not been processed
The bga soldering board has holes where the soldering is missing; show.
2. Poor design of BGA resistance solder film
Loss of pcb solder Assemble Assemble Assemble Assemble. After wave soldering, the solder on the holes can affect the reliability of BGA soldering, causing defects such as component shorts.
3. BGA solder plate design
The outgoing line of the BGA welding plate should not exceed 50% of the straight line of the welding plate, and the outgoing line of the power welding plate should not be less than 0.1mm, and then it can be thickened. In order to prevent deformation of the welding plate, the window of the welding plate shall not be larger than 0.5mm.
4. The size of the welding plate is not standard, too large or too small.
5. The size of the BGA pads is different, and the solder joints are irregular round circles of different sizes.
6. The distance between the outer frame of the BGA and the edge of the component body is too small
All parts of the component should be within the marking line. The distance between the frame wire and the packaged edge of the component should be greater than 1/2 of the dimension of the soldered end of the component.
Analysis of BGA soldering defects caused by incorrect PCB design
1. The hole at the bottom of the BGA has not been processed
The bga soldering board has holes where the soldering is missing; show.
2. Poor design of BGA resistance solder film
Loss of pcb solder Assemble Assemble Assemble Assemble. After wave soldering, the solder on the holes can affect the reliability of BGA soldering, causing defects such as component shorts.
3. BGA solder plate design
The outgoing line of the BGA welding plate should not exceed 50% of the straight line of the welding plate, and the outgoing line of the power welding plate should not be less than 0.1mm, and then it can be thickened. In order to prevent deformation of the welding plate, the window of the welding plate shall not be larger than 0.5mm.
4. The size of the welding plate is not standard, too large or too small.
5. The size of the BGA pads is different, and the solder joints are irregular round circles of different sizes.
6. The distance between the outer frame of the BGA and the edge of the component body is too small
All parts of the component should be within the marking line. The distance between the frame wire and the packaged edge of the component should be greater than 1/2 of the dimension of the soldered end of the component.
