2022-11-30
Influence of PCB Soldering Resistance Design on PCBA?
The role of solder mask in controlling welding defects during PCBA welding process is very important. PCB designers should minimize the spacing or air gap around pad features. Improper PCB solder mask design will lead to the following PCBA defects.
1. If the thickness of the solder mask exceeds the thickness of the PCB copper foil pad, suspension bridge and open circuit will be formed during reflow soldering,
2. The solder mask processing is not well aligned with the pad, resulting in contamination of the pad surface, poor solder eating or a large number of solder balls.
3. When there is a wire passing between two bonding pads, PCB resistance design shall be adopted to prevent welding short circuit:
4. When there are more than two SMDs close to each other and their pads share a wire, they should be separated by solder blocking to avoid stress caused by solder shrinkage, which may cause SMDs to shift or crack:
1. If the thickness of the solder mask exceeds the thickness of the PCB copper foil pad, suspension bridge and open circuit will be formed during reflow soldering,
2. The solder mask processing is not well aligned with the pad, resulting in contamination of the pad surface, poor solder eating or a large number of solder balls.
3. When there is a wire passing between two bonding pads, PCB resistance design shall be adopted to prevent welding short circuit:
4. When there are more than two SMDs close to each other and their pads share a wire, they should be separated by solder blocking to avoid stress caused by solder shrinkage, which may cause SMDs to shift or crack:
