2022-04-08
What are the design standards for pad shape and size in PCB design?
Pads are the basic building blocks of PCB surface mount assembly. On a printed circuit board, electrical connections for all components are made through pads. So, what are the design standards for pad shape and size in PCB design?
First, the shape of the pad:
Pads can be divided into 7 categories, according to the shape of the distinction as follows:
1. Square pads - when the components on the printed board are large and few, and the printed wires are simple, it is often used.
2. Circular pads - widely used in single and double-sided printed boards with regular arrangement of components.
3. Island-shaped pads - the connection between the pads and the pads is integrated, and is often used in vertical irregular arrangement installations.
4. Teardrop pads - often used when the connected traces are thin, and are often used in high frequency circuits.
5. Polygonal pads - used to distinguish pads with similar outer diameters and different apertures, which are convenient for processing and assembly.
6. Oval shaped pads - This type of pad has enough area to enhance the peel resistance and is often used in dual in-line devices.
7. Open-shaped pads - in order to ensure that after wave soldering, the pad holes for manual repair welding are not blocked by solder.
Second, Pad shape and size design standards:
1. The minimum single side of all pads is not less than 0.25mm, and the maximum diameter of the entire pad is not more than 3 times the diameter of the component.
2. Try to ensure that the distance between the edges of the two pads is greater than 0.4mm.
3. In the case of dense wiring, oval and oval pads are recommended.
4. For plug-in components, in order to avoid copper foil breakage during soldering, the single-sided connection pad should be completely covered with copper foil, while the minimum requirement for double-sided panels should be filled with teardrops.
5. All machine plug parts should be designed as drip pads along the direction of the bend to ensure that the solder joints at the bend are full.
6. The pads on the large-area copper skin should be chrysanthemum-shaped pads, so as not to be soldered.
The above are the relevant requirements for pad shape and size design standards in PCB design,hope it can give you some reference!
1. The minimum single side of all pads is not less than 0.25mm, and the maximum diameter of the entire pad is not more than 3 times the diameter of the component.
2. Try to ensure that the distance between the edges of the two pads is greater than 0.4mm.
3. In the case of dense wiring, oval and oval pads are recommended.
4. For plug-in components, in order to avoid copper foil breakage during soldering, the single-sided connection pad should be completely covered with copper foil, while the minimum requirement for double-sided panels should be filled with teardrops.
5. All machine plug parts should be designed as drip pads along the direction of the bend to ensure that the solder joints at the bend are full.
6. The pads on the large-area copper skin should be chrysanthemum-shaped pads, so as not to be soldered.
The above are the relevant requirements for pad shape and size design standards in PCB design,hope it can give you some reference!
