2022-12-14
Differences between aluminum substrate and Fr4
The basic structures of the two kinds of plates are different in different main characteristics. Compare the main characteristics of the aluminum substrate and FR-4 board: the heat dissipation of the aluminum substrate and FR-4 board is compared with the heat resistance of the substrate: the substrate is an aluminum substrate, and the FR-4 board is a transistor PCB. Because the heat dissipation of the substrate is different, the test data of the working temperature rise is different.
Differences between aluminum substrate and FR4
Performance:The comparison of wire (copper wire) and fuse current on different substrate materials, from the comparison between aluminum substrate and FR-4 plate, due to the high heat dissipation of metal substrate, the conduction is significantly improved, which illustrates the high heat dissipation characteristics of aluminum substrate from another perspective. The heat dissipation of aluminum substrate is related to its insulating layer thickness and thermal conductivity. The thinner the insulation layer is, the higher the thermal conductivity of aluminum substrate (but the lower the voltage resistance).
Machinability:Aluminum substrate has higher mechanical strength and toughness than FR-4 plate. To this end, large area printed boards can be made on aluminum substrates, on which large components can be installed.
Electromagnetic shielding:In order to ensure the performance of the circuit, some components in electronic products need to prevent electromagnetic wave radiation and interference. The aluminum substrate can be used as a shielding plate to shield electromagnetic waves.
Coefficient of thermal expansion:Due to the thermal expansion of FR-4 generally, especially the thermal expansion of plate thickness, the quality of metallized holes and wires is affected. The main reason is that the thermal expansion coefficient of copper in raw materials is 17 * 106cm/cm-C, and the thermal expansion coefficient of FR-4 sheet is 110 * 106cm/cm-C. The difference is large, which is easy to cause the expansion of heated substrate and the change of copper wire, as well as the damage of metal hole fracture to product reliability. Thermal expansion coefficient of aluminum substrate is 50 × 106cm/cm-C, smaller than ordinary FR-4 plate, close to the thermal expansion coefficient of copper foil. This is conducive to ensuring the quality and reliability of PCB.
FR-4 board is applicable to general circuit design and general electronic products due to different application circuits and different application fields.
Differences between aluminum substrate and FR4
Performance:The comparison of wire (copper wire) and fuse current on different substrate materials, from the comparison between aluminum substrate and FR-4 plate, due to the high heat dissipation of metal substrate, the conduction is significantly improved, which illustrates the high heat dissipation characteristics of aluminum substrate from another perspective. The heat dissipation of aluminum substrate is related to its insulating layer thickness and thermal conductivity. The thinner the insulation layer is, the higher the thermal conductivity of aluminum substrate (but the lower the voltage resistance).
Machinability:Aluminum substrate has higher mechanical strength and toughness than FR-4 plate. To this end, large area printed boards can be made on aluminum substrates, on which large components can be installed.
Electromagnetic shielding:In order to ensure the performance of the circuit, some components in electronic products need to prevent electromagnetic wave radiation and interference. The aluminum substrate can be used as a shielding plate to shield electromagnetic waves.
Coefficient of thermal expansion:Due to the thermal expansion of FR-4 generally, especially the thermal expansion of plate thickness, the quality of metallized holes and wires is affected. The main reason is that the thermal expansion coefficient of copper in raw materials is 17 * 106cm/cm-C, and the thermal expansion coefficient of FR-4 sheet is 110 * 106cm/cm-C. The difference is large, which is easy to cause the expansion of heated substrate and the change of copper wire, as well as the damage of metal hole fracture to product reliability. Thermal expansion coefficient of aluminum substrate is 50 × 106cm/cm-C, smaller than ordinary FR-4 plate, close to the thermal expansion coefficient of copper foil. This is conducive to ensuring the quality and reliability of PCB.
FR-4 board is applicable to general circuit design and general electronic products due to different application circuits and different application fields.
