2022-11-21
What are the advantages of using high-density patches in PCBA processing?
With the development of technology and the requirements of the market, more and more factories begin to use high-density patch to process Pcba. Next, let's talk about the advantages of PCBA high-density patch.
Seven benefits of PCBA high-density patch:
1. The same electronic product design can reduce the number of PCBA board layers, improve the density and reduce the cost.
2. Increase the wiring density and increase the line capacity per unit area with microporous thin wires, which can meet the assembly requirements of high-density contact components and facilitate the use of advanced construction.
3. By using microporous interconnection, the contact distance can be shortened, signal reflection and crosstalk between lines can be reduced, and the module can have better electrical performance and signal correctness.
4. In structure, thinner dielectric thickness and lower potential inductance can be selected.
5. Microholes have low aspect ratio, and the signal transmission reliability is higher than that of ordinary through-hole.
6. Microhole technology can shorten the distance between grounding and signal layers of carrier plate design, thus improving RF/electromagnetic wave/electrostatic discharge (RFI/EMI/ESD) interference. The number of grounding wires can be increased to prevent the damage of instantaneous discharge caused by electrostatic accumulation of components.
7. Micro holes can improve the flexibility of circuit configuration and simplify the circuit design.
Seven benefits of PCBA high-density patch:
1. The same electronic product design can reduce the number of PCBA board layers, improve the density and reduce the cost.
2. Increase the wiring density and increase the line capacity per unit area with microporous thin wires, which can meet the assembly requirements of high-density contact components and facilitate the use of advanced construction.
3. By using microporous interconnection, the contact distance can be shortened, signal reflection and crosstalk between lines can be reduced, and the module can have better electrical performance and signal correctness.
4. In structure, thinner dielectric thickness and lower potential inductance can be selected.
5. Microholes have low aspect ratio, and the signal transmission reliability is higher than that of ordinary through-hole.
6. Microhole technology can shorten the distance between grounding and signal layers of carrier plate design, thus improving RF/electromagnetic wave/electrostatic discharge (RFI/EMI/ESD) interference. The number of grounding wires can be increased to prevent the damage of instantaneous discharge caused by electrostatic accumulation of components.
7. Micro holes can improve the flexibility of circuit configuration and simplify the circuit design.
